Low Temperature Transient Liquid Phase Bonding of Alumina Ceramics with the Bi<sub>2</sub>O<sub>3</sub>-ZnO Interlayer

Low Temperature Transient Liquid Phase Bonding of Alumina Ceramics with the Bi<sub>2</sub>O<sub>3</sub>-ZnO Interlayer

Alumina ceramics were joined by a transient liquid phase (TLP) bonding method at relatively lower temperatures, using mixed powders of Bi<sub>2</sub>O<sub>3</sub> and ZnO with different weight ratios as interlayers between the ceramic components. Bonding was achieved at 750 °...

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Bibliographic Details
Main Authors: Maria Stosz, Sathya Narayanasamy, Thomas Graule, Dariusz Kata, Gurdial Blugan
Format: Article
Language:English
Published: MDPI AG 2022-10-01
Series:Materials
Subjects:
joining
interlayer
bonding
transient-liquid-phase bonding
joining of ceramics
low-temperature joining
Online Access:https://www.mdpi.com/1996-1944/15/19/6940

Internet

https://www.mdpi.com/1996-1944/15/19/6940

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