Sn-0.5Cu(-<i>x</i>)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses

Sn-0.5Cu(-<i>x</i>)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses

In this study, experiments were conducted to analyze the effect of 0.05 and 0.1 wt.% Al additions during the unsteady-state growth of the Sn-0.5wt.%Cu solder alloy. Various as-solidified specimens of each alloy were selected so that tensile tests could also be performed. Microstructural aspects such...

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Bibliographic Details
Main Authors: Thiago Soares Lima, Guilherme Lisboa de Gouveia, Rudimylla da Silva Septimio, Clarissa Barros da Cruz, Bismarck Luiz Silva, Crystopher Brito, José Eduardo Spinelli, Noé Cheung
Format: Article
Language:English
Published: MDPI AG 2019-02-01
Series:Metals
Subjects:
Sn–Cu–Al alloys
solidification
microstructure
tensile strength
Online Access:https://www.mdpi.com/2075-4701/9/2/241

Internet

https://www.mdpi.com/2075-4701/9/2/241

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