Effects of Moisture Diffusion on a System-in-Package Module by Moisture–Thermal–Mechanical-Coupled Finite Element Modeling

Effects of Moisture Diffusion on a System-in-Package Module by Moisture–Thermal–Mechanical-Coupled Finite Element Modeling

Epoxy molding compounds (EMCs) are commonly used in electronic products for chip encapsulation, but the moisture absorption of EMC can induce significant reliability challenges. In this study, the effects of hygrothermal conditions and structure parameters on moisture diffusion and the consequent in...

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Bibliographic Details
Main Authors: Zhiwen Chen, Zheng Feng, Meng Ruan, Guoliang Xu, Li Liu
Format: Article
Language:English
Published: MDPI AG 2022-10-01
Series:Micromachines
Subjects:
epoxy molding compound
hygroscopic test
moisture distribution
stress distribution
finite element modeling
Online Access:https://www.mdpi.com/2072-666X/13/10/1704

Internet

https://www.mdpi.com/2072-666X/13/10/1704

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