A Fluorinated Polyimide Based Nano Silver Paste with High Thermal Resistance and Outstanding Thixotropic Performance

Because of high conductivity, acceptable cost and good screen-printing process performance, silver pastes have been extensively used for making flexible electronics. However, there are few reported articles focusing on high heat resistance solidified silver pastes and their rheological properties. I...

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Bibliographic Details
Main Authors: Zhenhe Wang, Dong Wang, Chunbo Zhang, Wei Chen, Qingjie Meng, Hang Yuan, Shiyong Yang
Format: Article
Language:English
Published: MDPI AG 2023-02-01
Series:Polymers
Subjects:
Online Access:https://www.mdpi.com/2073-4360/15/5/1150