A Fluorinated Polyimide Based Nano Silver Paste with High Thermal Resistance and Outstanding Thixotropic Performance
Because of high conductivity, acceptable cost and good screen-printing process performance, silver pastes have been extensively used for making flexible electronics. However, there are few reported articles focusing on high heat resistance solidified silver pastes and their rheological properties. I...
Main Authors: | , , , , , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2023-02-01
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Series: | Polymers |
Subjects: | |
Online Access: | https://www.mdpi.com/2073-4360/15/5/1150 |