Impact of Isothermal Aging on Mechanical Properties of 92.8%Sn-3%Ag-0.5%Cu-3.3%Bi (Cyclomax) Solder Joints
During operation, electronic components are exposed to high temperatures that may last for long periods, depending on the operating duration. Solder joints are one of the components most affected by thermal aging while in service. In this research, the effect of thermal aging duration and temperatur...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-03-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/13/3/591 |