Impact of Isothermal Aging on Mechanical Properties of 92.8%Sn-3%Ag-0.5%Cu-3.3%Bi (Cyclomax) Solder Joints
During operation, electronic components are exposed to high temperatures that may last for long periods, depending on the operating duration. Solder joints are one of the components most affected by thermal aging while in service. In this research, the effect of thermal aging duration and temperatur...
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-03-01
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| Series: | Metals |
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| Online Access: | https://www.mdpi.com/2075-4701/13/3/591 |
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| author | Mohammad M. Hamasha Khozima Hamasha Sa’d Hamasha |
| author_facet | Mohammad M. Hamasha Khozima Hamasha Sa’d Hamasha |
| author_sort | Mohammad M. Hamasha |
| collection | DOAJ |
| description | During operation, electronic components are exposed to high temperatures that may last for long periods, depending on the operating duration. Solder joints are one of the components most affected by thermal aging while in service. In this research, the effect of thermal aging duration and temperature on the mechanical properties of 92.8%Sn-3%Ag-0.5%Cu-3.3%Bi (Cyclomax) was investigated. The novelty of this work lies in the study of the important properties of a new generation of Sn-Ag-Cu (SAC) materials (i.e., Cyclomax). Cyclomax is rare in industry and immature in research. To understand the effect of thermal aging, the microstructure was investigated, and changes in it and its mechanical properties were observed. To simulate solder joints in electronic devices, samples of solder balls were prepared and attached to copper pads on electronic boards. Most samples were then treated at 150 °C or 100 °C for up to 1000 h and some samples were left untreated for comparison. A scanning electron microscope (SEM) was used to obtain images of the microstructure. The shear stress–shear strain relationships, including the ultimate shear strength (USS), the modulus of elasticity and the ultimate energy (UE), were investigated. The microstructure images indicated the presence of a layer of Cu6Sn5 on top of the copper pad before thermal aging was applied. The thickness of this layer increased with the application of thermal aging over time. The results for the shear stress–shear strain relationship indicate that all of the USS, the total energy (TE) to shear off the solder balls and the UE decreased at the beginning of the thermal aging and then reversed to increase later. In general, isothermal aging reduces the performance of Cyclomax solder joints in terms of the minimum force and energy required to separate and subsequently damage electronic components. |
| first_indexed | 2024-03-11T06:10:05Z |
| format | Article |
| id | doaj.art-4529e7996a3f48579ef96d62f7ebd557 |
| institution | Directory Open Access Journal |
| issn | 2075-4701 |
| language | English |
| last_indexed | 2024-03-11T06:10:05Z |
| publishDate | 2023-03-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Metals |
| spelling | doaj.art-4529e7996a3f48579ef96d62f7ebd5572023-11-17T12:39:53ZengMDPI AGMetals2075-47012023-03-0113359110.3390/met13030591Impact of Isothermal Aging on Mechanical Properties of 92.8%Sn-3%Ag-0.5%Cu-3.3%Bi (Cyclomax) Solder JointsMohammad M. Hamasha0Khozima Hamasha1Sa’d Hamasha2Department of Industrial Engineering, Faculty of Engineering, The Hashemite University, Zarqa 13133, JordanDepartment of Basic Scientific Sciences, Al-Huson University College, Al-Balqa Applied University, Al-Salt 19117, JordanDepartment of Industrial and Systems Engineering, Auburn University, Auburn, AL 36849, USADuring operation, electronic components are exposed to high temperatures that may last for long periods, depending on the operating duration. Solder joints are one of the components most affected by thermal aging while in service. In this research, the effect of thermal aging duration and temperature on the mechanical properties of 92.8%Sn-3%Ag-0.5%Cu-3.3%Bi (Cyclomax) was investigated. The novelty of this work lies in the study of the important properties of a new generation of Sn-Ag-Cu (SAC) materials (i.e., Cyclomax). Cyclomax is rare in industry and immature in research. To understand the effect of thermal aging, the microstructure was investigated, and changes in it and its mechanical properties were observed. To simulate solder joints in electronic devices, samples of solder balls were prepared and attached to copper pads on electronic boards. Most samples were then treated at 150 °C or 100 °C for up to 1000 h and some samples were left untreated for comparison. A scanning electron microscope (SEM) was used to obtain images of the microstructure. The shear stress–shear strain relationships, including the ultimate shear strength (USS), the modulus of elasticity and the ultimate energy (UE), were investigated. The microstructure images indicated the presence of a layer of Cu6Sn5 on top of the copper pad before thermal aging was applied. The thickness of this layer increased with the application of thermal aging over time. The results for the shear stress–shear strain relationship indicate that all of the USS, the total energy (TE) to shear off the solder balls and the UE decreased at the beginning of the thermal aging and then reversed to increase later. In general, isothermal aging reduces the performance of Cyclomax solder joints in terms of the minimum force and energy required to separate and subsequently damage electronic components.https://www.mdpi.com/2075-4701/13/3/591solder jointCyclomaxthermal agingshear stress–shear strainmechanical properties |
| spellingShingle | Mohammad M. Hamasha Khozima Hamasha Sa’d Hamasha Impact of Isothermal Aging on Mechanical Properties of 92.8%Sn-3%Ag-0.5%Cu-3.3%Bi (Cyclomax) Solder Joints Metals solder joint Cyclomax thermal aging shear stress–shear strain mechanical properties |
| title | Impact of Isothermal Aging on Mechanical Properties of 92.8%Sn-3%Ag-0.5%Cu-3.3%Bi (Cyclomax) Solder Joints |
| title_full | Impact of Isothermal Aging on Mechanical Properties of 92.8%Sn-3%Ag-0.5%Cu-3.3%Bi (Cyclomax) Solder Joints |
| title_fullStr | Impact of Isothermal Aging on Mechanical Properties of 92.8%Sn-3%Ag-0.5%Cu-3.3%Bi (Cyclomax) Solder Joints |
| title_full_unstemmed | Impact of Isothermal Aging on Mechanical Properties of 92.8%Sn-3%Ag-0.5%Cu-3.3%Bi (Cyclomax) Solder Joints |
| title_short | Impact of Isothermal Aging on Mechanical Properties of 92.8%Sn-3%Ag-0.5%Cu-3.3%Bi (Cyclomax) Solder Joints |
| title_sort | impact of isothermal aging on mechanical properties of 92 8 sn 3 ag 0 5 cu 3 3 bi cyclomax solder joints |
| topic | solder joint Cyclomax thermal aging shear stress–shear strain mechanical properties |
| url | https://www.mdpi.com/2075-4701/13/3/591 |
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