The Electrical and Thermal Characteristics of Stacked GaN MISHEMT

To study the working performance of 3D stacked chips, a double-layer stacked GaN MISHEMTs structure was designed to study the electro-thermal characteristics and heat transfer process of stacked chips. Firstly, the electrical characteristics of double-layer and single-layer GaN MISHEMTs are compared...

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Bibliographic Details
Main Authors: Caixin Hui, Qiuqi Chen, Yijun Shi, Zhiyuan He, Yun Huang, Xiangjun Lu, Hongyue Wang, Jie Jiang, Guoguang Lu
Format: Article
Language:English
Published: MDPI AG 2022-11-01
Series:Micromachines
Subjects:
Online Access:https://www.mdpi.com/2072-666X/13/12/2101