Interfacial Reaction and Microstructure Evolution of Sn-9Zn/Ni(Cu) Solder Joints
Sn-9Zn solder is a promising Pb-free solder, but it tends to form bulky intermetallic compounds (IMC) grains at the interface when soldered with common simple metal Cu or Ni substrates. Interfacial reaction between Sn-9Zn solder and Ni(Cu) solid solution substrates at 250 °C and 350 ...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2019-05-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/9/5/604 |