Design and Modeling of a MEMS Dual-Backplate Capacitive Microphone with Spring-Supported Diaphragm for Mobile Device Applications

Design and Modeling of a MEMS Dual-Backplate Capacitive Microphone with Spring-Supported Diaphragm for Mobile Device Applications

New mobile devices need microphones with a small size, low noise level, reduced cost and high stability respect to variations of temperature and humidity. These characteristics can be obtained using Microelectromechanical Systems (MEMS) microphones, which are substituting for conventional electret c...

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Bibliographic Details
Main Authors: Néstor N. Peña-García, Luz A. Aguilera-Cortés, Max A. González-Palacios, Jean-Pierre Raskin, Agustín L. Herrera-May
Format: Article
Language:English
Published: MDPI AG 2018-10-01
Series:Sensors
Subjects:
capacitive microphone
dual backplate
FEM model
electret condenser microphones
spring-supported diaphragm
Sandia Ultra-Planar Multi-level MEMS Technology V (SUMMiT V) fabrication process
Online Access:http://www.mdpi.com/1424-8220/18/10/3545

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http://www.mdpi.com/1424-8220/18/10/3545

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