Comprehensive analysis of Sn58Bi/Cu solder joints reinforced with Mg particles: Wettability, thermal, mechanics, and microstructural characterization
In this study, the Sn58Bi-xMg (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0) composite solders were synthesized to explore the impact of Mg particles. The study examined the wettability, thermal properties, mechanical properties, microstructure, and growth of interfacial IMC (intermetallic compound) of composite...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-11-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423025607 |