Mechanism of defects and electrode structure on the performance of AlN-based metal semiconductor metal detectors

We used the metal-organic chemical vapor deposition(MOCVD) method to grow AlN material on a c-plane sapphire substrate and fabricate an AlN-based metal-semiconductor-metal (MSM) detector. Analyzing the influence mechanism of different dislocation densities in AlN materials and detector electrode str...

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Main Authors: Guanghui Li, Pengbo Wang, Xinran He, Yulong Meng, Feng Liang, Mei Zhou, Degang Zhao
Format: Article
Language:English
Published: IOP Publishing 2021-01-01
Series:Materials Research Express
Subjects:
Online Access:https://doi.org/10.1088/2053-1591/ac3dad
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author Guanghui Li
Pengbo Wang
Xinran He
Yulong Meng
Feng Liang
Mei Zhou
Degang Zhao
author_facet Guanghui Li
Pengbo Wang
Xinran He
Yulong Meng
Feng Liang
Mei Zhou
Degang Zhao
author_sort Guanghui Li
collection DOAJ
description We used the metal-organic chemical vapor deposition(MOCVD) method to grow AlN material on a c-plane sapphire substrate and fabricate an AlN-based metal-semiconductor-metal (MSM) detector. Analyzing the influence mechanism of different dislocation densities in AlN materials and detector electrode structure on the detector performance, it was found that the lower the dislocations can effectively reduce the dark current of the detector under zero bias voltage, and help improve the performance of the detector. The study also found that when the finger spacing of the detector remained the same and the finger width increased, the efficiency of the detector decreased, while the response time of the detector increased, when the finger width of the detector electrodes remained unchanged and the finger spacing increased, the response time of the detector increased. Therefore, the electrode finger width and finger spacing must be compromised in the design of the electrode structure to improve the performance of the AlN-based MSM detector.
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spelling doaj.art-46a428271b5146388f81343123c124b62023-08-09T15:59:35ZengIOP PublishingMaterials Research Express2053-15912021-01-0181212590210.1088/2053-1591/ac3dadMechanism of defects and electrode structure on the performance of AlN-based metal semiconductor metal detectorsGuanghui Li0https://orcid.org/0000-0003-3457-3686Pengbo Wang1Xinran He2Yulong Meng3Feng Liang4https://orcid.org/0000-0002-2064-8918Mei Zhou5Degang Zhao6Department of Applied Physics, China Agricultural University , Beijing 100083, People’s Republic of ChinaCollege of Science, China Agricultural University , Beijing 100083, People’s Republic of ChinaCollege of Science, China Agricultural University , Beijing 100083, People’s Republic of ChinaCollege of Science, China Agricultural University , Beijing 100083, People’s Republic of ChinaState Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, People’s Republic of ChinaDepartment of Applied Physics, China Agricultural University , Beijing 100083, People’s Republic of ChinaState Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, People’s Republic of ChinaWe used the metal-organic chemical vapor deposition(MOCVD) method to grow AlN material on a c-plane sapphire substrate and fabricate an AlN-based metal-semiconductor-metal (MSM) detector. Analyzing the influence mechanism of different dislocation densities in AlN materials and detector electrode structure on the detector performance, it was found that the lower the dislocations can effectively reduce the dark current of the detector under zero bias voltage, and help improve the performance of the detector. The study also found that when the finger spacing of the detector remained the same and the finger width increased, the efficiency of the detector decreased, while the response time of the detector increased, when the finger width of the detector electrodes remained unchanged and the finger spacing increased, the response time of the detector increased. Therefore, the electrode finger width and finger spacing must be compromised in the design of the electrode structure to improve the performance of the AlN-based MSM detector.https://doi.org/10.1088/2053-1591/ac3dadAlNmetal-semiconductor-metalMOCVDelectrode structureUV detector
spellingShingle Guanghui Li
Pengbo Wang
Xinran He
Yulong Meng
Feng Liang
Mei Zhou
Degang Zhao
Mechanism of defects and electrode structure on the performance of AlN-based metal semiconductor metal detectors
Materials Research Express
AlN
metal-semiconductor-metal
MOCVD
electrode structure
UV detector
title Mechanism of defects and electrode structure on the performance of AlN-based metal semiconductor metal detectors
title_full Mechanism of defects and electrode structure on the performance of AlN-based metal semiconductor metal detectors
title_fullStr Mechanism of defects and electrode structure on the performance of AlN-based metal semiconductor metal detectors
title_full_unstemmed Mechanism of defects and electrode structure on the performance of AlN-based metal semiconductor metal detectors
title_short Mechanism of defects and electrode structure on the performance of AlN-based metal semiconductor metal detectors
title_sort mechanism of defects and electrode structure on the performance of aln based metal semiconductor metal detectors
topic AlN
metal-semiconductor-metal
MOCVD
electrode structure
UV detector
url https://doi.org/10.1088/2053-1591/ac3dad
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AT pengbowang mechanismofdefectsandelectrodestructureontheperformanceofalnbasedmetalsemiconductormetaldetectors
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AT yulongmeng mechanismofdefectsandelectrodestructureontheperformanceofalnbasedmetalsemiconductormetaldetectors
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AT meizhou mechanismofdefectsandelectrodestructureontheperformanceofalnbasedmetalsemiconductormetaldetectors
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