Thermal Residual Stress Analysis of Soldering and Lamination Processes for Fabrication of Crystalline Silicon Photovoltaic Modules

In this study, we developed a finite element model to assess the residual stress in the soldering and lamination processes during the fabrication of crystalline silicon (Si) photovoltaic (PV) modules. We found that Si wafers experience maximum thermo-mechanical stress during the soldering process. T...

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Bibliographic Details
Main Authors: Hyunseong Shin, Ekyu Han, Nochang Park, Donghwan Kim
Format: Article
Language:English
Published: MDPI AG 2018-11-01
Series:Energies
Subjects:
Online Access:https://www.mdpi.com/1996-1073/11/12/3256