Thermal Residual Stress Analysis of Soldering and Lamination Processes for Fabrication of Crystalline Silicon Photovoltaic Modules
In this study, we developed a finite element model to assess the residual stress in the soldering and lamination processes during the fabrication of crystalline silicon (Si) photovoltaic (PV) modules. We found that Si wafers experience maximum thermo-mechanical stress during the soldering process. T...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2018-11-01
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| Series: | Energies |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1073/11/12/3256 |