Research progress of diamond/aluminum composite interface design
Diamond/aluminum composite material has the advantages of high thermal conductivity, low expansion, and lightweight, which has a wide range of application prospects in the field of electronic packaging thermal management. However, the serious interface problems between diamond and aluminum limit the...
| Main Authors: | , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Taylor & Francis Group
2022-12-01
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| Series: | Functional Diamond |
| Subjects: | |
| Online Access: | http://dx.doi.org/10.1080/26941112.2022.2050953 |