Effects of controlling grain growth mode on microstructures and properties of Cu foil

By means of direct current electrodeposition, Cu foil with columnar grain growth and equiaxed grain growth with different average grain sizes were prepared. Electron backscatter diffraction (EBSD), X-ray diffraction (XRD), atomic force microscopy (AFM), and transmission electron microscope (TEM) wer...

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Bibliographic Details
Main Authors: Junqing Han, Yuying Wu, Kai Zhao, Haoran Wang, Shushuai Liu, Xiangfa Liu
Format: Article
Language:English
Published: Elsevier 2023-05-01
Series:Journal of Materials Research and Technology
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785423005902