3D Numerical Investigation of Heat Transfer Performance in Liquid-liquid Taylor Flow
With recent advances in semiconductor technology, conventional cooling methods and standard coolants are no longer adequate to manage electronic chips’ enormous heat generation. Therefore, innovative cooling solutions are required to maintain these devices at optimum operating temperatures. Taylor f...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Shahid Chamran University of Ahvaz
2024-01-01
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| Series: | Journal of Applied and Computational Mechanics |
| Subjects: | |
| Online Access: | https://jacm.scu.ac.ir/article_18524_65254bc80ca20022d9a9a43a89cec618.pdf |