A hybrid Si IGBT and SiC MOSFET module development
A compact wirebond packaged phase-leg SiC/Si hybrid module was designed, developed, and tested. Details of the layout and gate drive designs are described. The IC chip for gate drive is carefully selected and compared. Dual pulse test confirmed that, the switching loss of hybrid module is close to p...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
China Electrotechnical Society
2017-12-01
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| Series: | CES Transactions on Electrical Machines and Systems |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/8241357 |