Effect of electron irradiation on microstructural evolution and mechanical properties of Sn3Ag0.5Cu solder joints
Power electronic devices face harsh radiation environments in deep space exploration. It is significant to study the reliability of solder joints of electronic devices in radiation environments. The effect of electron irradiation on the microstructure and mechanical properties of Sn3Ag0.5Cu (SAC305)...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-05-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424013036 |