Wafer-Level 3D Integration Based on Poly (Diallyl Phthalate) Adhesive Bonding

Wafer-Level 3D Integration Based on Poly (Diallyl Phthalate) Adhesive Bonding

Three-dimensional integration technology provides a promising total solution that can be used to achieve system-level integration with high function density and low cost. In this study, a wafer-level 3D integration technology using PDAP as an intermediate bonding polymer was applied effectively for...

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Detalhes bibliográficos
Main Authors: Zhong Fang, Peng You, Yijie Jia, Xuchao Pan, Yunlei Shi, Junjie Jiao, Yong He
Formato: Artigo
Idioma:English
Publicado em: MDPI AG 2021-12-01
Colecção:Micromachines
Assuntos:
3D integration
adhesive bonding
poly (diallyl phthalate)
SOI wafer
wafer thinning
Acesso em linha:https://www.mdpi.com/2072-666X/12/12/1586

Internet

https://www.mdpi.com/2072-666X/12/12/1586

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