Wafer-Level 3D Integration Based on Poly (Diallyl Phthalate) Adhesive Bonding

Wafer-Level 3D Integration Based on Poly (Diallyl Phthalate) Adhesive Bonding

Three-dimensional integration technology provides a promising total solution that can be used to achieve system-level integration with high function density and low cost. In this study, a wafer-level 3D integration technology using PDAP as an intermediate bonding polymer was applied effectively for...

Full description

Bibliographic Details
Main Authors: Zhong Fang, Peng You, Yijie Jia, Xuchao Pan, Yunlei Shi, Junjie Jiao, Yong He
Format: Article
Language:English
Published: MDPI AG 2021-12-01
Series:Micromachines
Subjects:
3D integration
adhesive bonding
poly (diallyl phthalate)
SOI wafer
wafer thinning
Online Access:https://www.mdpi.com/2072-666X/12/12/1586

Similar Items

Similar Items