Thermal Performance Analysis of Carbon Materials Based TSV in Three Dimensional Integrated Circuits

Thermal Performance Analysis of Carbon Materials Based TSV in Three Dimensional Integrated Circuits

This paper applies the carbon materials (i.e., SWCNT, MWCNT, and GNR) as new prospective filler materials of through silicon vias (TSV) for replacing the conventional copper (Cu) to improve the thermal performance of three-dimensional integrated circuits (3)-D ICs). The thermal performance of 3-D IC...

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Bibliographic Details
Main Authors: Peng Xu, Huan Huang, Bing-Qi Zhang, Zheng-Hua Tang
Format: Article
Language:English
Published: IEEE 2023-01-01
Series:IEEE Access
Subjects:
3-D ICs
TSV
thermal performances
Online Access:https://ieeexplore.ieee.org/document/10188918/

Internet

https://ieeexplore.ieee.org/document/10188918/

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