Thermal Performance Analysis of Carbon Materials Based TSV in Three Dimensional Integrated Circuits
This paper applies the carbon materials (i.e., SWCNT, MWCNT, and GNR) as new prospective filler materials of through silicon vias (TSV) for replacing the conventional copper (Cu) to improve the thermal performance of three-dimensional integrated circuits (3)-D ICs). The thermal performance of 3-D IC...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2023-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10188918/ |