Experimental Strategies for Studying Tribo-Electrochemical Aspects of Chemical–Mechanical Planarization
Chemical–mechanical planarization (CMP) is used to smoothen the topographies of a rough surface by combining several functions of tribology (friction, lubrication), chemistry, and electrochemistry (corrosion, wear, tribo-corrosion). The surface layer of interest is structurally weakened by the chemi...
Main Authors: | , |
---|---|
Format: | Article |
Language: | English |
Published: |
MDPI AG
2024-02-01
|
Series: | Lubricants |
Subjects: | |
Online Access: | https://www.mdpi.com/2075-4442/12/2/63 |