The effect of PVAc in silver ink for adhesion and conductivity of conductive pattern
The adhesion with substrate and conductivity of silver (Ag) conductive pattern are critical for practical applications of flexible electronic devices. Polymer vinyl acetate (PVAc) as an important solvent in Ag ink might largely improve the conductive pattern's adhesion property. However, the ad...
| Main Authors: | , , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2022-05-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785422005956 |