Heteroepitaxial Ge MOS Devices on Si Using Composite AlAs/GaAs Buffer

Structural and electrical characteristics of epitaxial germanium (Ge) heterogeneously integrated on silicon (Si) via a composite, large bandgap AlAs/GaAs buffer are investigated. Electrical characteristics of N-type metal-oxide-semiconductor (MOS) capacitors, fabricated from the aforementioned mater...

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Main Authors: Peter D. Nguyen, Michael Brian Clavel, Patrick S. Goley, Jheng-Sin Liu, Noah P. Allen, Louis J. Guido, Mantu K. Hudait
Format: Article
Language:English
Published: IEEE 2015-01-01
Series:IEEE Journal of the Electron Devices Society
Subjects:
Online Access:https://ieeexplore.ieee.org/document/7093118/
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author Peter D. Nguyen
Michael Brian Clavel
Patrick S. Goley
Jheng-Sin Liu
Noah P. Allen
Louis J. Guido
Mantu K. Hudait
author_facet Peter D. Nguyen
Michael Brian Clavel
Patrick S. Goley
Jheng-Sin Liu
Noah P. Allen
Louis J. Guido
Mantu K. Hudait
author_sort Peter D. Nguyen
collection DOAJ
description Structural and electrical characteristics of epitaxial germanium (Ge) heterogeneously integrated on silicon (Si) via a composite, large bandgap AlAs/GaAs buffer are investigated. Electrical characteristics of N-type metal-oxide-semiconductor (MOS) capacitors, fabricated from the aforementioned material stack are then presented. Simulated and experimental X-ray rocking curves show distinct Ge, AlAs, and GaAs epilayer peaks. Moreover, secondary ion mass spectrometry, energy dispersive X-ray spectroscopy (EDS) profile, and EDS line profile suggest limited interdiffusion of the underlying buffer into the Ge layer, which is further indicative of the successful growth of device-quality epitaxial Ge layer. The Ge MOS capacitor devices demonstrated low frequency dispersion of 1.80% per decade, low frequency-dependent flat-band voltage, VFB, shift of 153 mV, efficient Fermi level movement, and limited C-V stretch out. Low interface state density (Dit) from 8.55 &#x00D7; 10<sup>11</sup> to 1.09 &#x00D7; 10<sup>12</sup> cm<sup>-2</sup> eV<sup>-1</sup> is indicative of a high-quality oxide/Ge heterointerface, an effective electrical passivation of the Ge surface, and a Ge epitaxy with minimal defects. These superior electrical and material characteristics suggest the feasibility of utilizing large bandgap III-V buffers in the heterointegration of high-mobility channel materials on Si for future high-speed complementary metal-oxide semiconductor logic applications.
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spelling doaj.art-4a636b1e54e24070b98f99e72168d06f2022-12-21T23:00:54ZengIEEEIEEE Journal of the Electron Devices Society2168-67342015-01-013434134810.1109/JEDS.2015.24259597093118Heteroepitaxial Ge MOS Devices on Si Using Composite AlAs/GaAs BufferPeter D. Nguyen0Michael Brian Clavel1Patrick S. Goley2Jheng-Sin Liu3Noah P. Allen4Louis J. Guido5Mantu K. Hudait6Department of Electrical and Computer Engineering, Virginia Polytechnic Institute and State University, Blacksburg, VA, USADepartment of Electrical and Computer Engineering, Virginia Polytechnic Institute and State University, Blacksburg, VA, USADepartment of Electrical and Computer Engineering, Virginia Polytechnic Institute and State University, Blacksburg, VA, USADepartment of Electrical and Computer Engineering, Virginia Polytechnic Institute and State University, Blacksburg, VA, USADepartment of Electrical and Computer Engineering, Virginia Polytechnic Institute and State University, Blacksburg, VA, USADepartment of Electrical and Computer Engineering, Virginia Polytechnic Institute and State University, Blacksburg, VA, USADepartment of Electrical and Computer Engineering, Virginia Polytechnic Institute and State University, Blacksburg, VA, USAStructural and electrical characteristics of epitaxial germanium (Ge) heterogeneously integrated on silicon (Si) via a composite, large bandgap AlAs/GaAs buffer are investigated. Electrical characteristics of N-type metal-oxide-semiconductor (MOS) capacitors, fabricated from the aforementioned material stack are then presented. Simulated and experimental X-ray rocking curves show distinct Ge, AlAs, and GaAs epilayer peaks. Moreover, secondary ion mass spectrometry, energy dispersive X-ray spectroscopy (EDS) profile, and EDS line profile suggest limited interdiffusion of the underlying buffer into the Ge layer, which is further indicative of the successful growth of device-quality epitaxial Ge layer. The Ge MOS capacitor devices demonstrated low frequency dispersion of 1.80% per decade, low frequency-dependent flat-band voltage, VFB, shift of 153 mV, efficient Fermi level movement, and limited C-V stretch out. Low interface state density (Dit) from 8.55 &#x00D7; 10<sup>11</sup> to 1.09 &#x00D7; 10<sup>12</sup> cm<sup>-2</sup> eV<sup>-1</sup> is indicative of a high-quality oxide/Ge heterointerface, an effective electrical passivation of the Ge surface, and a Ge epitaxy with minimal defects. These superior electrical and material characteristics suggest the feasibility of utilizing large bandgap III-V buffers in the heterointegration of high-mobility channel materials on Si for future high-speed complementary metal-oxide semiconductor logic applications.https://ieeexplore.ieee.org/document/7093118/Germaniumheteroepitaxymetal oxide semiconductor (MOS) devicessiliconIII-V materials
spellingShingle Peter D. Nguyen
Michael Brian Clavel
Patrick S. Goley
Jheng-Sin Liu
Noah P. Allen
Louis J. Guido
Mantu K. Hudait
Heteroepitaxial Ge MOS Devices on Si Using Composite AlAs/GaAs Buffer
IEEE Journal of the Electron Devices Society
Germanium
heteroepitaxy
metal oxide semiconductor (MOS) devices
silicon
III-V materials
title Heteroepitaxial Ge MOS Devices on Si Using Composite AlAs/GaAs Buffer
title_full Heteroepitaxial Ge MOS Devices on Si Using Composite AlAs/GaAs Buffer
title_fullStr Heteroepitaxial Ge MOS Devices on Si Using Composite AlAs/GaAs Buffer
title_full_unstemmed Heteroepitaxial Ge MOS Devices on Si Using Composite AlAs/GaAs Buffer
title_short Heteroepitaxial Ge MOS Devices on Si Using Composite AlAs/GaAs Buffer
title_sort heteroepitaxial ge mos devices on si using composite alas gaas buffer
topic Germanium
heteroepitaxy
metal oxide semiconductor (MOS) devices
silicon
III-V materials
url https://ieeexplore.ieee.org/document/7093118/
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