Deformation mechanics of sputtered copper layers during nanoindentation tests
The mechanical properties of the thin sputtered copper layer on the SiO2-coated silicon substrate is needed as part of the requirements in quantifying the reliability of the Through-Silicon Via (TSV) interconnects. In this respect, two different Cu coating layers, each from the different sputtering...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Universiti Malaysia Pahang Publishing
2020-03-01
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| Series: | Journal of Mechanical Engineering and Sciences |
| Subjects: | |
| Online Access: | https://journal.ump.edu.my/jmes/article/view/2002 |