Deformation mechanics of sputtered copper layers during nanoindentation tests
The mechanical properties of the thin sputtered copper layer on the SiO2-coated silicon substrate is needed as part of the requirements in quantifying the reliability of the Through-Silicon Via (TSV) interconnects. In this respect, two different Cu coating layers, each from the different sputtering...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
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Universiti Malaysia Pahang Publishing
2020-03-01
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| Series: | Journal of Mechanical Engineering and Sciences |
| Subjects: | |
| Online Access: | https://journal.ump.edu.my/jmes/article/view/2002 |
| _version_ | 1797694653942726656 |
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| author | M. A. A. Afripin N. A. Fadil M. Nasir Tamin |
| author_facet | M. A. A. Afripin N. A. Fadil M. Nasir Tamin |
| author_sort | M. A. A. Afripin |
| collection | DOAJ |
| description | The mechanical properties of the thin sputtered copper layer on the SiO2-coated silicon substrate is needed as part of the requirements in quantifying the reliability of the Through-Silicon Via (TSV) interconnects. In this respect, two different Cu coating layers, each from the different sputtering process, are examined. A series of nanoindentation tests are performed on the Cu coating layer samples with indenter speeds ranging from 80 to 400 nm/s, and the indentation depths of 320 nm. The properties of elastic modulus, hardness and the hardening behavior of the Cu coating layers have been quantified. Results show that the coating with higher contamination of C at 8.41 wt. % displays a significant hardening and a peak load level, as reflected in the measured nanoindentation load-displacement curves. However, insignificant effect of the applied probe displacement speeds up to 400 nm/s on the resulting properties of the coating is registered. The Johnson-Cook constitutive equation adequately describes the strain rate-dependent hardening behavior of the Cu coating layer. |
| first_indexed | 2024-03-12T03:00:59Z |
| format | Article |
| id | doaj.art-4b6977412f71448da91dacd3202bb97e |
| institution | Directory Open Access Journal |
| issn | 2289-4659 2231-8380 |
| language | English |
| last_indexed | 2024-03-12T03:00:59Z |
| publishDate | 2020-03-01 |
| publisher | Universiti Malaysia Pahang Publishing |
| record_format | Article |
| series | Journal of Mechanical Engineering and Sciences |
| spelling | doaj.art-4b6977412f71448da91dacd3202bb97e2023-09-03T14:44:01ZengUniversiti Malaysia Pahang PublishingJournal of Mechanical Engineering and Sciences2289-46592231-83802020-03-011416504651310.15282/jmes.14.1.2020.25.0510Deformation mechanics of sputtered copper layers during nanoindentation testsM. A. A. Afripin0N. A. Fadil1M. Nasir Tamin2School of Mechanical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia, 81310 Johor Bahru, MalaysiaSchool of Mechanical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia, 81310 Johor Bahru, MalaysiaFaculty of Mechanical Engineering, Universiti Teknologi Malaysia, Johor Bahru, MalaysiaThe mechanical properties of the thin sputtered copper layer on the SiO2-coated silicon substrate is needed as part of the requirements in quantifying the reliability of the Through-Silicon Via (TSV) interconnects. In this respect, two different Cu coating layers, each from the different sputtering process, are examined. A series of nanoindentation tests are performed on the Cu coating layer samples with indenter speeds ranging from 80 to 400 nm/s, and the indentation depths of 320 nm. The properties of elastic modulus, hardness and the hardening behavior of the Cu coating layers have been quantified. Results show that the coating with higher contamination of C at 8.41 wt. % displays a significant hardening and a peak load level, as reflected in the measured nanoindentation load-displacement curves. However, insignificant effect of the applied probe displacement speeds up to 400 nm/s on the resulting properties of the coating is registered. The Johnson-Cook constitutive equation adequately describes the strain rate-dependent hardening behavior of the Cu coating layer.https://journal.ump.edu.my/jmes/article/view/2002hardening curvehardnessnanoindentation testsputtered copper coatingyoung’s modulus |
| spellingShingle | M. A. A. Afripin N. A. Fadil M. Nasir Tamin Deformation mechanics of sputtered copper layers during nanoindentation tests Journal of Mechanical Engineering and Sciences hardening curve hardness nanoindentation test sputtered copper coating young’s modulus |
| title | Deformation mechanics of sputtered copper layers during nanoindentation tests |
| title_full | Deformation mechanics of sputtered copper layers during nanoindentation tests |
| title_fullStr | Deformation mechanics of sputtered copper layers during nanoindentation tests |
| title_full_unstemmed | Deformation mechanics of sputtered copper layers during nanoindentation tests |
| title_short | Deformation mechanics of sputtered copper layers during nanoindentation tests |
| title_sort | deformation mechanics of sputtered copper layers during nanoindentation tests |
| topic | hardening curve hardness nanoindentation test sputtered copper coating young’s modulus |
| url | https://journal.ump.edu.my/jmes/article/view/2002 |
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