Elastic modulus and coefficient of thermal expansion of piezoelectric Al1−xScxN (up to x = 0.41) thin films

Elastic modulus and coefficient of thermal expansion of piezoelectric Al1−xScxN (up to x = 0.41) thin films

Aluminum scandium nitride (Al1−xScxN with x = 0–0.41) thin films were deposited by reactive pulsed-DC magnetron sputtering on Si(001) and Al2O3(0001) substrates. X-ray diffraction indicated high degree of c-axis orientation in all the films, and based on pole figure measurements, epitaxial relations...

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Bibliographic Details
Main Authors: Yuan Lu, Markus Reusch, Nicolas Kurz, Anli Ding, Tim Christoph, Mario Prescher, Lutz Kirste, Oliver Ambacher, Agnė Žukauskaitė
Format: Article
Language:English
Published: AIP Publishing LLC 2018-07-01
Series:APL Materials
Online Access:http://dx.doi.org/10.1063/1.5040190

Internet

http://dx.doi.org/10.1063/1.5040190

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