Modeling of ultra-thin diamond slice and simulation of SiC wafer cutting based on Python language

Modeling of ultra-thin diamond slice and simulation of SiC wafer cutting based on Python language

To address issues like edge collapse and subsurface damage during the cutting process of SiC wafers, a model for cutting SiC wafers with ultra-thin diamond blades was established by combining Python language and Abaqus finite element analysis software. The effects of cutting parameters on cutting fo...

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Bibliographic Details
Main Authors: Yan HE, Xiang LI, Xingjun GAO, Lin FAN, Ming LIU, Zicheng XU
Format: Article
Language:zho
Published: Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd. 2023-10-01
Series:Jin'gangshi yu moliao moju gongcheng
Subjects:
sic wafer
python language
ultra-thin diamond slice
cutting parameters
damage
Online Access:http://www.jgszz.cn/article/doi/10.13394/j.cnki.jgszz.2003.0001

Internet

http://www.jgszz.cn/article/doi/10.13394/j.cnki.jgszz.2003.0001

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