Modeling of ultra-thin diamond slice and simulation of SiC wafer cutting based on Python language
To address issues like edge collapse and subsurface damage during the cutting process of SiC wafers, a model for cutting SiC wafers with ultra-thin diamond blades was established by combining Python language and Abaqus finite element analysis software. The effects of cutting parameters on cutting fo...
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | zho |
| Published: |
Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd.
2023-10-01
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| Series: | Jin'gangshi yu moliao moju gongcheng |
| Subjects: | |
| Online Access: | http://www.jgszz.cn/article/doi/10.13394/j.cnki.jgszz.2003.0001 |