Investigation of Poly Silicon Channel Variation in Vertical 3D NAND Flash Memory

Since the most of three dimensional (3D) NAND devices’ channel is composed of polysilicon grain, the actual 3D NAND channel has a wave-shaped channel, not uniform shape. In this study, we defined the curvature of the channel as a ‘Wave Factor (WF)’ parameter, and sim...

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Bibliographic Details
Main Authors: Inyoung Lee, Dae Hwan Kim, Daewoong Kang, Il Hwan Cho
Format: Article
Language:English
Published: IEEE 2022-01-01
Series:IEEE Access
Subjects:
Online Access:https://ieeexplore.ieee.org/document/9912418/