Interconnections for Additively Manufactured Hybridized Printed Electronics in Harsh Environments
The ability to fabricate functional 3D conductive elements via additive manufacturing has opened up a unique sector of ‘hybridized printed electronics’. In doing so, many of the rigid standards (i.e., planar circuit boards, potting, etc.,) of traditional electronics are abandoned. However, one criti...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-06-01
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| Series: | Designs |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2411-9660/4/2/14 |