Fluxless ultrasonic soldering of SiC ceramics and Cu by Bi–Ag–Ti based solder
The aim of this research was to study the microstructure in soldered joint of SiC ceramics with Cu in cases of flux-less soldering with ultrasound assistance. The soldering was performed by ultrasonic activation of newly developed Bi–Ag–Ti based solder alloy. This new solder alloy was developed for...
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
AIMS Press
2020-03-01
|
| Series: | AIMS Materials Science |
| Subjects: | |
| Online Access: | https://www.aimspress.com/article/10.3934/matersci.2020.1.24/fulltext.html |