Experimental studies on application of silver paste in thermosonic flip-chip bonding
In this subject, thermosonic flip-chip technology was introduced to conduct low-temperature bonding of Ag paste and chip interconnection experiments with micro solder joints. The coating and printing method is used to realize the uniform coating of the Ag paste on the micro Cu pillars, and the thick...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
SAGE Publishing
2023-03-01
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| Series: | Journal of Low Frequency Noise, Vibration and Active Control |
| Online Access: | https://doi.org/10.1177/14613484221118144 |