N‐polar deep‐recess GaN MISHEMT with enhanced ft·LG by gate dielectric thinning
Abstract The authors report a novel structure to improve the high‐frequency performance of nitrogen‐polar GaN deep‐recess high electron mobility transistors (HEMTs) wherein a timed plasma etch was used to tailor the profile of the gate dielectric. A favourable trade‐off between gate fringing capacit...
Main Authors: | , , , , , , , , |
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Format: | Article |
Language: | English |
Published: |
Wiley
2024-07-01
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Series: | Electronics Letters |
Subjects: | |
Online Access: | https://doi.org/10.1049/ell2.13272 |