Enhanced thermal conductivity and microwave dielectric properties by mesostructural design of multiphase nanocomposite
Next-generation packaging materials are expected to have higher thermal conductivity, because the heat accumulated in high-performance electronic equipment should be removed to increase the service life of the equipment. At the same time, the dielectric loss of the material needs to be reduced to le...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
KeAi Communications Co., Ltd.
2022-06-01
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| Series: | Nano Materials Science |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S258996512100060X |