Direct Application of Carbon Nanotubes (CNTs) Grown by Chemical Vapor Deposition (CVD) for Integrated Circuits (ICs) Interconnection: Challenges and Developments

With the continuous shrinkage of integrated circuit (IC) dimensions, traditional copper interconnect technology is gradually unable to meet the requirements for performance improvement. Carbon nanotubes have gained widespread attention and research as a potential alternative to copper, due to their...

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Bibliographic Details
Main Authors: Zhenbang Chu, Baohui Xu, Jie Liang
Format: Article
Language:English
Published: MDPI AG 2023-10-01
Series:Nanomaterials
Subjects:
Online Access:https://www.mdpi.com/2079-4991/13/20/2791