On the Reproducibility of Thermal Measurements and of Related Thermal Metrics in Static and Transient Tests of Power Devices
Traditionally the thermal behavior of power devices is characterized by temperature measurements at the junction and at accessible external points. In large modules composed of thin chips and materials of high thermal conductivity the shape and distribution of the heat trajectories are influenced by...
Main Authors: | , , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2020-01-01
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Series: | Energies |
Subjects: | |
Online Access: | https://www.mdpi.com/1996-1073/13/3/557 |