On the Reproducibility of Thermal Measurements and of Related Thermal Metrics in Static and Transient Tests of Power Devices
Traditionally the thermal behavior of power devices is characterized by temperature measurements at the junction and at accessible external points. In large modules composed of thin chips and materials of high thermal conductivity the shape and distribution of the heat trajectories are influenced by...
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| Format: | Article |
| Language: | English |
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MDPI AG
2020-01-01
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| Series: | Energies |
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| Online Access: | https://www.mdpi.com/1996-1073/13/3/557 |
| _version_ | 1811298280395505664 |
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| author | Gabor Farkas Dirk Schweitzer Zoltan Sarkany Marta Rencz |
| author_facet | Gabor Farkas Dirk Schweitzer Zoltan Sarkany Marta Rencz |
| author_sort | Gabor Farkas |
| collection | DOAJ |
| description | Traditionally the thermal behavior of power devices is characterized by temperature measurements at the junction and at accessible external points. In large modules composed of thin chips and materials of high thermal conductivity the shape and distribution of the heat trajectories are influenced by the external boundary represented by the cooling mount. This causes mediocre repeatability of the characteristic <i>R<sub>thJC</sub></i> junction to case thermal resistance even in measurements at the same laboratory and causes very poor reproducibility among sites using dissimilar instrumentation. The Transient Dual Interface Methodology (TDIM) is based on the comparison of measured structure functions. With this method high repeatability can be achieved although introducing severe changes into the measurement environment is the essence of this test scheme. There is a systematic difference between thermal data measured with TDIM method and that measured with temperature probes, but we found that this difference was smaller than the scatter of the latter method. For checking production stability, we propose the use of a structure function-based <i>R<sub>th@Cth</sub></i> thermal metric, which is the thermal resistance value reached at the thermal capacitance belonging to the mass of the package base. This metric condenses the consistency of internal structural elements into a single number. |
| first_indexed | 2024-04-13T06:17:10Z |
| format | Article |
| id | doaj.art-4f4fde71b35245beb11a5fa93fb3b376 |
| institution | Directory Open Access Journal |
| issn | 1996-1073 |
| language | English |
| last_indexed | 2024-04-13T06:17:10Z |
| publishDate | 2020-01-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Energies |
| spelling | doaj.art-4f4fde71b35245beb11a5fa93fb3b3762022-12-22T02:58:47ZengMDPI AGEnergies1996-10732020-01-0113355710.3390/en13030557en13030557On the Reproducibility of Thermal Measurements and of Related Thermal Metrics in Static and Transient Tests of Power DevicesGabor Farkas0Dirk Schweitzer1Zoltan Sarkany2Marta Rencz3Mentor, a Siemens Business, 1117 Budapest, HungaryInfineon Technologies AG, 85579 Neubiberg, GermanyDepartment of Electron Devices, Budapest University of Technology and Economics, 1117 Budapest, HungaryDepartment of Electron Devices, Budapest University of Technology and Economics, 1117 Budapest, HungaryTraditionally the thermal behavior of power devices is characterized by temperature measurements at the junction and at accessible external points. In large modules composed of thin chips and materials of high thermal conductivity the shape and distribution of the heat trajectories are influenced by the external boundary represented by the cooling mount. This causes mediocre repeatability of the characteristic <i>R<sub>thJC</sub></i> junction to case thermal resistance even in measurements at the same laboratory and causes very poor reproducibility among sites using dissimilar instrumentation. The Transient Dual Interface Methodology (TDIM) is based on the comparison of measured structure functions. With this method high repeatability can be achieved although introducing severe changes into the measurement environment is the essence of this test scheme. There is a systematic difference between thermal data measured with TDIM method and that measured with temperature probes, but we found that this difference was smaller than the scatter of the latter method. For checking production stability, we propose the use of a structure function-based <i>R<sub>th@Cth</sub></i> thermal metric, which is the thermal resistance value reached at the thermal capacitance belonging to the mass of the package base. This metric condenses the consistency of internal structural elements into a single number.https://www.mdpi.com/1996-1073/13/3/557thermal transient testingnon-destructive testingthermal testabilityaccuracy repeatability and reproducibility of thermal measurementsthermal testing standards |
| spellingShingle | Gabor Farkas Dirk Schweitzer Zoltan Sarkany Marta Rencz On the Reproducibility of Thermal Measurements and of Related Thermal Metrics in Static and Transient Tests of Power Devices Energies thermal transient testing non-destructive testing thermal testability accuracy repeatability and reproducibility of thermal measurements thermal testing standards |
| title | On the Reproducibility of Thermal Measurements and of Related Thermal Metrics in Static and Transient Tests of Power Devices |
| title_full | On the Reproducibility of Thermal Measurements and of Related Thermal Metrics in Static and Transient Tests of Power Devices |
| title_fullStr | On the Reproducibility of Thermal Measurements and of Related Thermal Metrics in Static and Transient Tests of Power Devices |
| title_full_unstemmed | On the Reproducibility of Thermal Measurements and of Related Thermal Metrics in Static and Transient Tests of Power Devices |
| title_short | On the Reproducibility of Thermal Measurements and of Related Thermal Metrics in Static and Transient Tests of Power Devices |
| title_sort | on the reproducibility of thermal measurements and of related thermal metrics in static and transient tests of power devices |
| topic | thermal transient testing non-destructive testing thermal testability accuracy repeatability and reproducibility of thermal measurements thermal testing standards |
| url | https://www.mdpi.com/1996-1073/13/3/557 |
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