Comparative study on the thermal performance of surface‐mounted devices light‐emitting diode packaging with poly(1,4‐cyclohexylenedimethylene terephthalate) and epoxy moulding compound frames

Comparative study on the thermal performance of surface‐mounted devices light‐emitting diode packaging with poly(1,4‐cyclohexylenedimethylene terephthalate) and epoxy moulding compound frames

Abstract With the emergence of the different light‐emitting diode (LED) packaging materials, the thermal analysis of LED device packaging with different materials has become urgent. The thermal performance of LED packaging with a poly(1,4‐cyclohexylenedimethylene terephthalate) frame (PCT‐LED) and L...

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Bibliographic Details
Main Authors: Dezhi Zhao, Zhihua Xiong, Cong Chen, Yunfei Niu
Format: Article
Language:English
Published: Wiley 2022-02-01
Series:IET Optoelectronics
Subjects:
glass transition
light emitting diodes
moulding
brightness
thermal analysis
thermal resistance
Online Access:https://doi.org/10.1049/ote2.12044

Internet

https://doi.org/10.1049/ote2.12044

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