Ultra-rapid and low-temperature soldering of hypereutectic Al-Si alloys by ultrasonic-assisted soldering with In interlayer in air for electronic application
Hypereutectic Al-Si alloys were soldered by an ultrasonic-assisted soldering with In interlayer for only 0.1 s at 160 °C in air. The introduction of ultrasonic vibration into the soldering process promoted the formation of the liquid phase by its acoustic softening effect, ultrasonic cavitation effe...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2022-06-01
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| Series: | Journal of Advanced Joining Processes |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2666330922000218 |