Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment
Sintered silver paste is a popular material for die attachment technology in power electronics. However, using traditional nano-silver paste when fabricating sintered joints has intrinsic material problems that cannot be overcome, such as the high cost of nano-silver particles and their potential he...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-11-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785421012151 |