Low‐temperature‐curable and photo‐patternable benzocyclobutene‐derived aggregation‐induced emission‐active polymer dielectrics

Low‐temperature‐curable and photo‐patternable benzocyclobutene‐derived aggregation‐induced emission‐active polymer dielectrics

Abstract The high curing temperatures required for traditional benzocyclobutene (BCB) materials have posed limitations on their applicability in high‐temperature‐sensitive fields. To address this challenge, our work focuses on the synthesis of a novel tetraphenylethylene (TPE)‐functionalized BCB mon...

Full description

Bibliographic Details
Main Authors: Ziwei Yuan, Meng Xie, Jianlei Qian, Wenjie Fan, Menglu Li, Liao Guo, Yan Sun, Wenxin Fu
Format: Article
Language:English
Published: Wiley 2024-06-01
Series:Aggregate
Subjects:
aggregation‐induced emission
benzocyclobutene
low‐temperature curing
wafer bonding
Williamson reactions
Online Access:https://doi.org/10.1002/agt2.487

Internet

https://doi.org/10.1002/agt2.487

Similar Items