Effect of Fins Arrangement on Thermal Performance in Microelectronics Devices
Heat sink fins arrangement are important in heat management in microelectronics devices because it helps in the dissipation of heat from the chip level device to the environment and provide an efficiently working device. In this light, investigation was conducted on the effect of fins arrangement o...
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| Format: | Article |
| Language: | English |
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Joint Coordination Centre of the World Bank assisted National Agricultural Research Programme (NARP)
2019-01-01
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| Series: | Journal of Applied Sciences and Environmental Management |
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| Online Access: | https://www.ajol.info/index.php/jasem/article/view/181395 |