Pad-Printing as a Fabrication Process for Flexible and Compact Multilayer Circuits
The purpose of this paper is to present a newly developed process for the fabrication of multilayer circuits based on the pad-printing technique. Even though the maturity level, in terms of accuracy, substrate type and print size of several printing industrial processes is relatively high, the fabri...
| Hauptverfasser: | , , |
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| Format: | Artikel |
| Sprache: | English |
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MDPI AG
2021-10-01
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| Schriftenreihe: | Sensors |
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| Online Zugang: | https://www.mdpi.com/1424-8220/21/20/6802 |