A Study on the Pattern Effects of Chemical Mechanical Planarization with CNN-Based Models
Chemical mechanical polishing (CMP) has become one of the most important process stages in the fabrication of advanced integrated circuits (IC). The CMP pattern effect strongly influences the planarization of the chip surface morphology after CMP, degrading the performance and the yield of the circu...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-07-01
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| Series: | Electronics |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-9292/9/7/1158 |