Micro-Raman for Local Strain Evaluation of GaN LEDs and Si Chips Assembled on Cu Substrates

Micro-Raman for Local Strain Evaluation of GaN LEDs and Si Chips Assembled on Cu Substrates

Integrated circuits are created by interfacing different materials, semiconductors, and metals, which are appropriately deposited or grown on substrates and layers soldered together. Therefore, the characteristics of starting materials and process temperatures are of great importance, as they can in...

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Bibliographic Details
Main Authors: Enrico Brugnolotto, Claudia Mezzalira, Fosca Conti, Danilo Pedron, Raffaella Signorini
Format: Article
Language:English
Published: MDPI AG 2023-12-01
Series:Micromachines
Subjects:
integrated circuits
assembly process
GaN
Si
thermomechanical local strain
mapping
Online Access:https://www.mdpi.com/2072-666X/15/1/25

Internet

https://www.mdpi.com/2072-666X/15/1/25

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