A Novel Capacitorless 1T DRAM with Embedded Oxide Layer

A novel vertical dual surrounding gate transistor with embedded oxide layer is proposed for capacitorless single transistor DRAM (1T DRAM). The embedded oxide layer is innovatively used to improve the retention time by reducing the recombination rate of stored holes and sensing electrons. Based on T...

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Main Authors: Dongxue Zhao, Zhiliang Xia, Tao Yang, Yuancheng Yang, Wenxi Zhou, Zongliang Huo
Format: Article
Language:English
Published: MDPI AG 2022-10-01
Series:Micromachines
Subjects:
Online Access:https://www.mdpi.com/2072-666X/13/10/1772
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author Dongxue Zhao
Zhiliang Xia
Tao Yang
Yuancheng Yang
Wenxi Zhou
Zongliang Huo
author_facet Dongxue Zhao
Zhiliang Xia
Tao Yang
Yuancheng Yang
Wenxi Zhou
Zongliang Huo
author_sort Dongxue Zhao
collection DOAJ
description A novel vertical dual surrounding gate transistor with embedded oxide layer is proposed for capacitorless single transistor DRAM (1T DRAM). The embedded oxide layer is innovatively used to improve the retention time by reducing the recombination rate of stored holes and sensing electrons. Based on TCAD simulations, the new structure is predicted to not only have the characteristics of fast access, random read and integration of 4F<sup>2</sup> cell, but also to realize good retention and deep scaling. At the same time, the new structure has the potential of scaling compared with the conventional capacitorless 1T DRAM.
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spelling doaj.art-550664b76124426b909e4f63ebf5ff052023-11-24T01:24:14ZengMDPI AGMicromachines2072-666X2022-10-011310177210.3390/mi13101772A Novel Capacitorless 1T DRAM with Embedded Oxide LayerDongxue Zhao0Zhiliang Xia1Tao Yang2Yuancheng Yang3Wenxi Zhou4Zongliang Huo5Institute of the Microelectronics of Chinese Academy of Sciences, Beijing 100029, ChinaInstitute of the Microelectronics of Chinese Academy of Sciences, Beijing 100029, ChinaInstitute of the Microelectronics of Chinese Academy of Sciences, Beijing 100029, ChinaYangtze Memory Technologies Co., Ltd., Wuhan 430205, ChinaYangtze Memory Technologies Co., Ltd., Wuhan 430205, ChinaInstitute of the Microelectronics of Chinese Academy of Sciences, Beijing 100029, ChinaA novel vertical dual surrounding gate transistor with embedded oxide layer is proposed for capacitorless single transistor DRAM (1T DRAM). The embedded oxide layer is innovatively used to improve the retention time by reducing the recombination rate of stored holes and sensing electrons. Based on TCAD simulations, the new structure is predicted to not only have the characteristics of fast access, random read and integration of 4F<sup>2</sup> cell, but also to realize good retention and deep scaling. At the same time, the new structure has the potential of scaling compared with the conventional capacitorless 1T DRAM.https://www.mdpi.com/2072-666X/13/10/1772capacitorless1T DRAMretentionscalingembedded oxide layer
spellingShingle Dongxue Zhao
Zhiliang Xia
Tao Yang
Yuancheng Yang
Wenxi Zhou
Zongliang Huo
A Novel Capacitorless 1T DRAM with Embedded Oxide Layer
Micromachines
capacitorless
1T DRAM
retention
scaling
embedded oxide layer
title A Novel Capacitorless 1T DRAM with Embedded Oxide Layer
title_full A Novel Capacitorless 1T DRAM with Embedded Oxide Layer
title_fullStr A Novel Capacitorless 1T DRAM with Embedded Oxide Layer
title_full_unstemmed A Novel Capacitorless 1T DRAM with Embedded Oxide Layer
title_short A Novel Capacitorless 1T DRAM with Embedded Oxide Layer
title_sort novel capacitorless 1t dram with embedded oxide layer
topic capacitorless
1T DRAM
retention
scaling
embedded oxide layer
url https://www.mdpi.com/2072-666X/13/10/1772
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