Advanced Thermal Management for High-Power ICs: Optimizing Heatsink and Airflow Design

Advanced Thermal Management for High-Power ICs: Optimizing Heatsink and Airflow Design

In the rapidly advancing field of 5G technology, efficient thermal management is essential for enhancing the performance and reliability of high-power-density integrated circuits (ICs). This paper introduces an innovative approach to cooling these critical components, significantly surpassing tradit...

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Bibliographic Details
Main Authors: Ali Jebelli, Nafiseh Lotfi, Mohammad Saeid Zare, Mustapha C. E. Yagoub
Format: Article
Language:English
Published: MDPI AG 2024-10-01
Series:Applied Sciences
Subjects:
power amplifier (PA)
Gallium Nitride (GaN)
integrated circuit (IC)
heatsink
computational fluid dynamics (CFD)
thermal management
Online Access:https://www.mdpi.com/2076-3417/14/20/9406

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https://www.mdpi.com/2076-3417/14/20/9406

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