Atomistic insights into silver-indium solid solution softening mechanism for microelectronics packaging

Atomistic insights into silver-indium solid solution softening mechanism for microelectronics packaging

Silver-indium solid solution is the key material in advancing low-temperature/pressure solid-state technology for electronics packaging, due to its rare solid solution softening (SSS) phenomenon. In this work, the critical resolved shear stress (CRSS) for slip, ideal shear strength and critical twin...

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Bibliographic Details
Main Authors: Shuang Zhao, Bing Zheng, Donglin Zhang, Xiaochen Xie, Zhibo Qu, Yong Wang, Xiuchen Zhao, Jiaqi Wu, Chin C. Lee, Yongjun Huo
Format: Article
Language:English
Published: Elsevier 2023-05-01
Series:Journal of Materials Research and Technology
Subjects:
Solid-state bonding
Solid solution softening
Generalized planar fault energy
Microelectronics packaging
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785423009092

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http://www.sciencedirect.com/science/article/pii/S2238785423009092

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